Copper-based sliding material

In a copper-based sliding material in which a Cu alloy layer contains 5% to 30% by mass of Bi, and the balance consisting of Cu and an unavoidable impurity, Bi is dispersed as particles of a Bi phase in the Cu alloy layer, and the mass ratio of the particles having a particle size of 2 to 50 µm and...

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Bibliographische Detailangaben
Hauptverfasser: Tujimoto, Kentaro, Sato, Ryo, Imai, Takuo
Format: Patent
Sprache:eng ; fre ; ger
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