METHOD FOR COATING A SUBSTRATE INSIDE A VACUUM CHAMBER BY MEANS OF PLASMA-ASSISTED CHEMICAL VAPOR DEPOSITION

The invention relates to a device for depositing a layer on a substrate (2) inside a vacuum chamber (1) by means of plasma-assisted chemical vapor deposition, comprising at least one inlet (3) for introducing at least one gas into the vacuum chamber (1) and at least one magnetron (4) equipped with a...

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Bibliographische Detailangaben
Hauptverfasser:	FAHLAND, MATTHIAS, FAHLTEICH, JOHN, BUNK, SEBASTIAN, ZEIBE, RAINER, BLÜTHNER, RALF
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to a device for depositing a layer on a substrate (2) inside a vacuum chamber (1) by means of plasma-assisted chemical vapor deposition, comprising at least one inlet (3) for introducing at least one gas into the vacuum chamber (1) and at least one magnetron (4) equipped with a target (5; 9) for producing a plasma, wherein the target (5; 9) has a temperature of at least 300 °C at least in one region during the deposition of the layer.