SOUND INSULATION FLOOR STRUCTURE AND SOUND INSULATION FLOOR COMPONENTS AS WELL AS METHOD FOR REDUCING FLOOR IMPACT SOUNDS

SOUND INSULATION FLOOR STRUCTURE AND SOUND INSULATION FLOOR COMPONENTS AS WELL AS METHOD FOR REDUCING FLOOR IMPACT SOUNDS

The present invention relates to a sound insulation floor component comprising: a plurality of joists to be disposed parallel to each other at intervals; and a plurality of compressable layers, each having a thickness larger than a thickness of each one of the joists, wherein the joists and the comp...

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Hauptverfasser: MIYAKE, Noboru, TAKAMATSU, Masahiko, KOIKE, Masaru, KOIZUMI, Satoshi, KANEZAKO, Hideki, HIRATA, Kazutoshi, KIYOOKA, Sumito, ADACHI, Atsumi, HAYASHI, Kohei
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BUILDING
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
FIXED CONSTRUCTIONS
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creator MIYAKE, Noboru
TAKAMATSU, Masahiko
KOIKE, Masaru
KOIZUMI, Satoshi
KANEZAKO, Hideki
HIRATA, Kazutoshi
KIYOOKA, Sumito
ADACHI, Atsumi
HAYASHI, Kohei
description The present invention relates to a sound insulation floor component comprising: a plurality of joists to be disposed parallel to each other at intervals; and a plurality of compressable layers, each having a thickness larger than a thickness of each one of the joists, wherein the joists and the compressable layers are disposed alternately, and wherein the joists, the compressable layers, or both contain a buffer member, the buffer member comprises a nonwoven structure, and the nonwoven structure comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the nonwoven structure to fix the fibers.
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subjects BUILDING
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
FIXED CONSTRUCTIONS
title SOUND INSULATION FLOOR STRUCTURE AND SOUND INSULATION FLOOR COMPONENTS AS WELL AS METHOD FOR REDUCING FLOOR IMPACT SOUNDS
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