METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component (90) is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes the steps of preparing a CFRP core (10), forming a through hole (1) so a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HINATA, TATSUYA, SAMEJIMA, SOHEI, OSUGA, HIROYUKI, SAKURADA, KAZUHITO, YAGASAKI, AKIRA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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