Modular heat sink
The present invention concerns a heat sink (1) for semiconductor light emitters or for light absorbers and comprising: - A central portion (2) provided with attachment means (7, 8, 9) on which it is possible to fix the light emitter or the absorber and; - a plurality of tabs (3) that branches off fr...
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| creator | BROCCIO, CONCETTA BROCCIO, GIUSEPPE SERRAINO, CARMELO |
| description | The present invention concerns a heat sink (1) for semiconductor light emitters or for light absorbers and comprising:
- A central portion (2) provided with attachment means (7, 8, 9) on which it is possible to fix the light emitter or the absorber and;
- a plurality of tabs (3) that branches off from the central body and distanced between them so as to form a plurality of channels for the circulation of air. In accordance with the invention, the tabs (3) are arranged substantially parallel between them and at a reciprocal distance comprised within a range variable between 9 mm and 11 mm, in such a way as to optimize the passage of air for cooling. The heat sink (1) has an external overall shape in general parallelepiped-shaped, which favours the modular composition of two or more modular sinks (1) and the scalability with the least encumbrance. |
| format | Patent |
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- A central portion (2) provided with attachment means (7, 8, 9) on which it is possible to fix the light emitter or the absorber and;
- a plurality of tabs (3) that branches off from the central body and distanced between them so as to form a plurality of channels for the circulation of air. In accordance with the invention, the tabs (3) are arranged substantially parallel between them and at a reciprocal distance comprised within a range variable between 9 mm and 11 mm, in such a way as to optimize the passage of air for cooling. The heat sink (1) has an external overall shape in general parallelepiped-shaped, which favours the modular composition of two or more modular sinks (1) and the scalability with the least encumbrance.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121212&DB=EPODOC&CC=EP&NR=2533282A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121212&DB=EPODOC&CC=EP&NR=2533282A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BROCCIO, CONCETTA</creatorcontrib><creatorcontrib>BROCCIO, GIUSEPPE</creatorcontrib><creatorcontrib>SERRAINO, CARMELO</creatorcontrib><title>Modular heat sink</title><description>The present invention concerns a heat sink (1) for semiconductor light emitters or for light absorbers and comprising:
- A central portion (2) provided with attachment means (7, 8, 9) on which it is possible to fix the light emitter or the absorber and;
- a plurality of tabs (3) that branches off from the central body and distanced between them so as to form a plurality of channels for the circulation of air. In accordance with the invention, the tabs (3) are arranged substantially parallel between them and at a reciprocal distance comprised within a range variable between 9 mm and 11 mm, in such a way as to optimize the passage of air for cooling. The heat sink (1) has an external overall shape in general parallelepiped-shaped, which favours the modular composition of two or more modular sinks (1) and the scalability with the least encumbrance.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD0zU8pzUksUshITSxRKM7My-ZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAUamxsZGFkaORsZEKAEAgeoe_w</recordid><startdate>20121212</startdate><enddate>20121212</enddate><creator>BROCCIO, CONCETTA</creator><creator>BROCCIO, GIUSEPPE</creator><creator>SERRAINO, CARMELO</creator><scope>EVB</scope></search><sort><creationdate>20121212</creationdate><title>Modular heat sink</title><author>BROCCIO, CONCETTA ; BROCCIO, GIUSEPPE ; SERRAINO, CARMELO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2533282A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BROCCIO, CONCETTA</creatorcontrib><creatorcontrib>BROCCIO, GIUSEPPE</creatorcontrib><creatorcontrib>SERRAINO, CARMELO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BROCCIO, CONCETTA</au><au>BROCCIO, GIUSEPPE</au><au>SERRAINO, CARMELO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Modular heat sink</title><date>2012-12-12</date><risdate>2012</risdate><abstract>The present invention concerns a heat sink (1) for semiconductor light emitters or for light absorbers and comprising:
- A central portion (2) provided with attachment means (7, 8, 9) on which it is possible to fix the light emitter or the absorber and;
- a plurality of tabs (3) that branches off from the central body and distanced between them so as to form a plurality of channels for the circulation of air. In accordance with the invention, the tabs (3) are arranged substantially parallel between them and at a reciprocal distance comprised within a range variable between 9 mm and 11 mm, in such a way as to optimize the passage of air for cooling. The heat sink (1) has an external overall shape in general parallelepiped-shaped, which favours the modular composition of two or more modular sinks (1) and the scalability with the least encumbrance.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Modular heat sink |
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