LED-PACKAGING RESIN BODY, LED DEVICE, AND METHOD FOR MANUFACTURING LED DEVICE
An LED encapsulation resin body of the present invention includes: a phosphor (13); a heat resistance material (15) arranged on, or in the vicinity of, a surface of the phosphor (13); and a silicone resin (12) in which the phosphor (13) with the heat resistance material (15) arranged thereon is disp...
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| creator | OHBAYASHI, TAKASHI SHIRAISHI, SEIGO |
| description | An LED encapsulation resin body of the present invention includes: a phosphor (13); a heat resistance material (15) arranged on, or in the vicinity of, a surface of the phosphor (13); and a silicone resin (12) in which the phosphor (13) with the heat resistance material (15) arranged thereon is dispersed. |
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| language | eng ; fre ; ger |
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| subjects | ADHESIVES ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE |
| title | LED-PACKAGING RESIN BODY, LED DEVICE, AND METHOD FOR MANUFACTURING LED DEVICE |
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