Leadframe and method for packaging semiconductor die

In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed (502) on an assembly surface. The die-pad has a base portion (202) resting on the assembly surface, an upper portion (204) on the base portion extending lateral...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Walczyk, Sven, Wong, Fei-Ying, Umali, Pompeo, Tsang, Paul Pang Hing, Lee, SteveChiFai, Boettcher, Tim, Groenhuis, Roelf Anco Jacob, Rohrmoser, Bernd, Noren, Markus Bjoern Erik
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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