Leadframe and method for packaging semiconductor die

Leadframe and method for packaging semiconductor die

In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed (502) on an assembly surface. The die-pad has a base portion (202) resting on the assembly surface, an upper portion (204) on the base portion extending lateral...

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Hauptverfasser: Walczyk, Sven, Wong, Fei-Ying, Umali, Pompeo, Tsang, Paul Pang Hing, Lee, SteveChiFai, Boettcher, Tim, Groenhuis, Roelf Anco Jacob, Rohrmoser, Bernd, Noren, Markus Bjoern Erik
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Walczyk, Sven
Wong, Fei-Ying
Umali, Pompeo
Tsang, Paul Pang Hing
Lee, SteveChiFai
Boettcher, Tim
Groenhuis, Roelf Anco Jacob
Rohrmoser, Bernd
Noren, Markus Bjoern Erik
description In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed (502) on an assembly surface. The die-pad has a base portion (202) resting on the assembly surface, an upper portion (204) on the base portion extending laterally from the base portion, and a support arm (208) extending from and supporting the upper portion of die-pad. A semiconductor die (206) is wirebonded (504) to a top surface of the upper portion of the die-pad. The semiconductor die is wirebonded (506) to the one or more lead-pads (210). The semiconductor die and leadframe are encased (508) in a package material (802). The package material fills a space between the upper portion of the die-pad and the assembly surface. A portion of the support arm located in a cutting lane is removed (512).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Leadframe and method for packaging semiconductor die
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