POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK

POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK

A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive pl...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FOLTS, DOUGLAS C
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator FOLTS, DOUGLAS C
description A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2510543A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2510543A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2510543A13</originalsourceid><addsrcrecordid>eNrjZNAP8A93DVJw9XF1Dgny9_N0VnAMDnb1dfKJVAj3DPFQCPbxDwlxdVHwcHUMCfb08-ZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAUamhgamJsaOhsZEKAEA2WAlzQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK</title><source>esp@cenet</source><creator>FOLTS, DOUGLAS C</creator><creatorcontrib>FOLTS, DOUGLAS C</creatorcontrib><description>A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121017&amp;DB=EPODOC&amp;CC=EP&amp;NR=2510543A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121017&amp;DB=EPODOC&amp;CC=EP&amp;NR=2510543A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FOLTS, DOUGLAS C</creatorcontrib><title>POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK</title><description>A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAP8A93DVJw9XF1Dgny9_N0VnAMDnb1dfKJVAj3DPFQCPbxDwlxdVHwcHUMCfb08-ZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAUamhgamJsaOhsZEKAEA2WAlzQ</recordid><startdate>20121017</startdate><enddate>20121017</enddate><creator>FOLTS, DOUGLAS C</creator><scope>EVB</scope></search><sort><creationdate>20121017</creationdate><title>POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK</title><author>FOLTS, DOUGLAS C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2510543A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>FOLTS, DOUGLAS C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FOLTS, DOUGLAS C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK</title><date>2012-10-17</date><risdate>2012</risdate><abstract>A power electronic assembly includes a pair of thermally and electrically conductive plates, and semiconductor switching elements positioned between contact surfaces of the pair of conductive plates. A first of the semiconductor switching elements is positioned at a first region of the conductive plates, and a second of the semiconductor switching elements positioned at a second region of the conductive plates. At least one of the conductive plates includes an aperture positioned between the first region and the second region of the conductive plates, such that in a compressed state, a contact surface of the conductive plate associated with the first region is substantially parallel to and offset from that of the second region in a direction parallel to the direction of compression.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP2510543A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title POWER ELECTRONIC ASSEMBLY WITH SLOTTED HEATSINK
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T17%3A52%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FOLTS,%20DOUGLAS%20C&rft.date=2012-10-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2510543A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true