SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING

SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING

An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and "shape" of an adhesive "dot&q...

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Hauptverfasser: PATEL, Vipulkumar, FANGMAN, John, Matthew, FANGMAN, John, NADEAU, Mary, GOTHOSKAR, Prakash, WEBSTER, Mark
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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creator PATEL, Vipulkumar
FANGMAN, John, Matthew
FANGMAN, John
NADEAU, Mary
GOTHOSKAR, Prakash
WEBSTER, Mark
description An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and "shape" of an adhesive "dot" so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots ("channels") may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2507830A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2507830A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2507830A43</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHPxIOof9gOFYhW9xmTTLjTZ0KRFvJQi8SRaqP_HHHyAp4GZWYtraDlG1KDYGar7TkZiB4Y7YB_J0i0330qFFl0ENmBJdVwotp5dVgH6QK4GqRsMNCBc2OkstmL1mJ5L2v24EWAwqqZI83tMyzzd0yt9RvT7Y3k6V6U8VH8sX8zLMT0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING</title><source>esp@cenet</source><creator>PATEL, Vipulkumar ; FANGMAN, John, Matthew ; FANGMAN, John ; NADEAU, Mary ; GOTHOSKAR, Prakash ; WEBSTER, Mark</creator><creatorcontrib>PATEL, Vipulkumar ; FANGMAN, John, Matthew ; FANGMAN, John ; NADEAU, Mary ; GOTHOSKAR, Prakash ; WEBSTER, Mark</creatorcontrib><description>An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and "shape" of an adhesive "dot" so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots ("channels") may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180110&amp;DB=EPODOC&amp;CC=EP&amp;NR=2507830A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180110&amp;DB=EPODOC&amp;CC=EP&amp;NR=2507830A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PATEL, Vipulkumar</creatorcontrib><creatorcontrib>FANGMAN, John, Matthew</creatorcontrib><creatorcontrib>FANGMAN, John</creatorcontrib><creatorcontrib>NADEAU, Mary</creatorcontrib><creatorcontrib>GOTHOSKAR, Prakash</creatorcontrib><creatorcontrib>WEBSTER, Mark</creatorcontrib><title>SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING</title><description>An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and "shape" of an adhesive "dot" so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots ("channels") may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHPxIOof9gOFYhW9xmTTLjTZ0KRFvJQi8SRaqP_HHHyAp4GZWYtraDlG1KDYGar7TkZiB4Y7YB_J0i0330qFFl0ENmBJdVwotp5dVgH6QK4GqRsMNCBc2OkstmL1mJ5L2v24EWAwqqZI83tMyzzd0yt9RvT7Y3k6V6U8VH8sX8zLMT0</recordid><startdate>20180110</startdate><enddate>20180110</enddate><creator>PATEL, Vipulkumar</creator><creator>FANGMAN, John, Matthew</creator><creator>FANGMAN, John</creator><creator>NADEAU, Mary</creator><creator>GOTHOSKAR, Prakash</creator><creator>WEBSTER, Mark</creator><scope>EVB</scope></search><sort><creationdate>20180110</creationdate><title>SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING</title><author>PATEL, Vipulkumar ; FANGMAN, John, Matthew ; FANGMAN, John ; NADEAU, Mary ; GOTHOSKAR, Prakash ; WEBSTER, Mark</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2507830A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PATEL, Vipulkumar</creatorcontrib><creatorcontrib>FANGMAN, John, Matthew</creatorcontrib><creatorcontrib>FANGMAN, John</creatorcontrib><creatorcontrib>NADEAU, Mary</creatorcontrib><creatorcontrib>GOTHOSKAR, Prakash</creatorcontrib><creatorcontrib>WEBSTER, Mark</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PATEL, Vipulkumar</au><au>FANGMAN, John, Matthew</au><au>FANGMAN, John</au><au>NADEAU, Mary</au><au>GOTHOSKAR, Prakash</au><au>WEBSTER, Mark</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING</title><date>2018-01-10</date><risdate>2018</risdate><abstract>An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and "shape" of an adhesive "dot" so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots ("channels") may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
title SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T22%3A55%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=PATEL,%20Vipulkumar&rft.date=2018-01-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2507830A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true