Electronic circuit with double insulating layer and method for manufacturing same

The circuit (300) has an electrical conducting layer (330) including a receiving portion (A) for receiving an electronic component (140). Thermal via-holes (361) connect the portion of the layer to another electrical conducting layer (323). The via-holes are passed through an electrically insulating layer (327) and not passed through one of the electrical conducting layers. The via-holes are holes filled with an inner coating material and a heat conductive material. A thermal conducting layer (310) dissipates heat generated by currents flowing in the circuit. An independent claim is also included for a method for manufacturing an electronic circuit.