Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

A manufacturing method of a multilayer substrate (101) is provided, comprising: laminating single-sided conductor patterned films (21, 21 a, 21 b), each of which has a resin film (23), a conductor pattern (22, 22a) formed only on a single side of the resin film, and a via hole (24, 24a, 24b) formed...

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Hauptverfasser: YOKOCHI, TOMOHIRO, KAMIYA, TETSUAKI, KAMIYA, YASUTAKA, MASUDA, GENTARO, YAZAKI, YOSHITARO, KONDO, KOJI, HARADA, TOSHIKAZU, ONODA, RYUICHI
Format: Patent
Sprache:eng ; fre ; ger
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator YOKOCHI, TOMOHIRO
KAMIYA, TETSUAKI
KAMIYA, YASUTAKA
MASUDA, GENTARO
YAZAKI, YOSHITARO
KONDO, KOJI
HARADA, TOSHIKAZU
ONODA, RYUICHI
description A manufacturing method of a multilayer substrate (101) is provided, comprising: laminating single-sided conductor patterned films (21, 21 a, 21 b), each of which has a resin film (23), a conductor pattern (22, 22a) formed only on a single side of the resin film, and a via hole (24, 24a, 24b) formed at a predetermined location and filled with an interlayer connection material (50); and adhering the single-sided conductor patterned films to each other to form a multilayer substrate; wherein an arbitrary two of single-sided conductor patterned films (21 a, 21 b) are laminated so that surfaces thereof on which the conductor patterns (22) are not formed face with each other, while remaining single-sided conductor patterned films (21) are laminated in such a manner that a surface on which the conductor pattern (22) is formed and a surface on which the conductor pattern (22) is not formed face with each other, whereby electrodes (32, 37) are formed by the conductive patterns (22) at both sides of the multilayer substrate (101).
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
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