LED CHIP ASSEMBLY, LED PACKAGE, AND MANUFACTURING METHOD OF LED PACKAGE

Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NARITA Shinya, HIGUMA Satoshi, HIROTSURU Hideki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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