ABRASIVE TOOL WITH FLAT AND CONSISTENT SURFACE TOPOGRAPHY FOR CONDITIONING A CMP PAD AND METHOD FOR MAKING
An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges...
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creator | HALL, RICHARD, W., J WU, JIANHUI ZHANG, GUOHUA |
description | An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond. |
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The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.</description><language>eng ; fre ; ger</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150826&DB=EPODOC&CC=EP&NR=2454052A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150826&DB=EPODOC&CC=EP&NR=2454052A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HALL, RICHARD, W., J</creatorcontrib><creatorcontrib>WU, JIANHUI</creatorcontrib><creatorcontrib>ZHANG, GUOHUA</creatorcontrib><title>ABRASIVE TOOL WITH FLAT AND CONSISTENT SURFACE TOPOGRAPHY FOR CONDITIONING A CMP PAD AND METHOD FOR MAKING</title><description>An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy00KwjAQhuFuXIh6h7mAILU9wJifJthmQjJVXJUicSGihXp_tMUDuPoW7_MtszseAkZ7UsBENZwtG9A1MqCTIMhFG1k5htgGjWJSnqqA3lxAU5iEtGzJWVcBgmg8eJTzuVFsSM6qweO3r7PFrX-MafPbVQZasTDbNLy6NA79NT3Tu1M-L8piV-ZY7P8gH_9RNWA</recordid><startdate>20150826</startdate><enddate>20150826</enddate><creator>HALL, RICHARD, W., J</creator><creator>WU, JIANHUI</creator><creator>ZHANG, GUOHUA</creator><scope>EVB</scope></search><sort><creationdate>20150826</creationdate><title>ABRASIVE TOOL WITH FLAT AND CONSISTENT SURFACE TOPOGRAPHY FOR CONDITIONING A CMP PAD AND METHOD FOR MAKING</title><author>HALL, RICHARD, W., J ; WU, JIANHUI ; ZHANG, GUOHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2454052A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2015</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HALL, RICHARD, W., J</creatorcontrib><creatorcontrib>WU, JIANHUI</creatorcontrib><creatorcontrib>ZHANG, GUOHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HALL, RICHARD, W., J</au><au>WU, JIANHUI</au><au>ZHANG, GUOHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ABRASIVE TOOL WITH FLAT AND CONSISTENT SURFACE TOPOGRAPHY FOR CONDITIONING A CMP PAD AND METHOD FOR MAKING</title><date>2015-08-26</date><risdate>2015</risdate><abstract>An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
title | ABRASIVE TOOL WITH FLAT AND CONSISTENT SURFACE TOPOGRAPHY FOR CONDITIONING A CMP PAD AND METHOD FOR MAKING |
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