ABRASIVE TOOL WITH FLAT AND CONSISTENT SURFACE TOPOGRAPHY FOR CONDITIONING A CMP PAD AND METHOD FOR MAKING

An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges...

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Hauptverfasser: HALL, RICHARD, W., J, WU, JIANHUI, ZHANG, GUOHUA
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Sprache:eng ; fre ; ger
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creator HALL, RICHARD, W., J
WU, JIANHUI
ZHANG, GUOHUA
description An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.
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The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. 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language eng ; fre ; ger
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
title ABRASIVE TOOL WITH FLAT AND CONSISTENT SURFACE TOPOGRAPHY FOR CONDITIONING A CMP PAD AND METHOD FOR MAKING
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