MECHANICAL ISOLATION FOR MEMS ELECTRICAL CONTACTS

In accordance with the disclosure, a MEMS substrate is provided that includes: a central planar portion configured to support a MEMS device; and a first electrical pad coplanar with the central planar portion, the first pad being connected to the central planar portion through a first flexure, where...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CALVET, Robert J, GUTIERREZ, Roman C
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS TRANSPORTING
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