Integral heat sink with spiral manifolds

A heat sink (10) is provided for directly cooling at least one electronic device package (20) having an upper contact surface (22) and a lower contact surface (24). The heat sink comprises a cooling piece (16) formed of at least one thermally conductive material, where the cooling piece defines at l...

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Hauptverfasser:	PAUTSCH, ADAM GREGORY, LAZATIN, PATRICK JOSE, GUNTURI, SATISH SIVARAMA
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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creator	PAUTSCH, ADAM GREGORY LAZATIN, PATRICK JOSE GUNTURI, SATISH SIVARAMA
description	A heat sink (10) is provided for directly cooling at least one electronic device package (20) having an upper contact surface (22) and a lower contact surface (24). The heat sink comprises a cooling piece (16) formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold (30) configured to receive a coolant and at least one outlet manifolds (32) configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels (34) disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds (30) and to deliver the coolant to the outlet manifolds (32). The millichannels (34) and inlet and outlet manifolds (30, 32) are further configured to directly cool one of the upper and lower contact surface (22, 24) of the electronic device package (20) by direct contact with the coolant, such that the heat sink (10) comprises an integral heat sink (10).
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The heat sink comprises a cooling piece (16) formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold (30) configured to receive a coolant and at least one outlet manifolds (32) configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels (34) disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds (30) and to deliver the coolant to the outlet manifolds (32). The millichannels (34) and inlet and outlet manifolds (30, 32) are further configured to directly cool one of the upper and lower contact surface (22, 24) of the electronic device package (20) by direct contact with the coolant, such that the heat sink (10) comprises an integral heat sink (10).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120229&DB=EPODOC&CC=EP&NR=2423958A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120229&DB=EPODOC&CC=EP&NR=2423958A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PAUTSCH, ADAM GREGORY</creatorcontrib><creatorcontrib>LAZATIN, PATRICK JOSE</creatorcontrib><creatorcontrib>GUNTURI, SATISH SIVARAMA</creatorcontrib><title>Integral heat sink with spiral manifolds</title><description>A heat sink (10) is provided for directly cooling at least one electronic device package (20) having an upper contact surface (22) and a lower contact surface (24). 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language	eng ; fre ; ger
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subjects	BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
title	Integral heat sink with spiral manifolds
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