Semiconductor light emitting device and image display unit

A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of...

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1. Verfasser: Kurimoto, Takeo
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description A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2416388B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2416388B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2416388B13</originalsourceid><addsrcrecordid>eNrjZLAKTs3NTM7PSylNLskvUsjJTM8oUQAKlZRk5qUrpKSWZSanKiTmpShk5iampyqkZBYX5CRWKpTmZZbwMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wAjE0MzYwsLJ0NjIpQAADmXLt8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor light emitting device and image display unit</title><source>esp@cenet</source><creator>Kurimoto, Takeo</creator><creatorcontrib>Kurimoto, Takeo</creatorcontrib><description>A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.</description><language>eng ; fre ; ger</language><subject>ADVERTISING ; BASIC ELECTRIC ELEMENTS ; CRYPTOGRAPHY ; DISPLAY ; DISPLAYING ; EDUCATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LABELS OR NAME-PLATES ; PHYSICS ; SEALS ; SEMICONDUCTOR DEVICES ; SIGNS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180926&amp;DB=EPODOC&amp;CC=EP&amp;NR=2416388B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180926&amp;DB=EPODOC&amp;CC=EP&amp;NR=2416388B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kurimoto, Takeo</creatorcontrib><title>Semiconductor light emitting device and image display unit</title><description>A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.</description><subject>ADVERTISING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CRYPTOGRAPHY</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LABELS OR NAME-PLATES</subject><subject>PHYSICS</subject><subject>SEALS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SIGNS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAKTs3NTM7PSylNLskvUsjJTM8oUQAKlZRk5qUrpKSWZSanKiTmpShk5iampyqkZBYX5CRWKpTmZZbwMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wAjE0MzYwsLJ0NjIpQAADmXLt8</recordid><startdate>20180926</startdate><enddate>20180926</enddate><creator>Kurimoto, Takeo</creator><scope>EVB</scope></search><sort><creationdate>20180926</creationdate><title>Semiconductor light emitting device and image display unit</title><author>Kurimoto, Takeo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2416388B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2018</creationdate><topic>ADVERTISING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CRYPTOGRAPHY</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LABELS OR NAME-PLATES</topic><topic>PHYSICS</topic><topic>SEALS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SIGNS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kurimoto, Takeo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kurimoto, Takeo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor light emitting device and image display unit</title><date>2018-09-26</date><risdate>2018</risdate><abstract>A light emitting device includes a package having a recess, a lead frame buried in the package so that one end of the lead frame is exposed at a bottom of the recess and another end protrudes to an exterior of the package, a light emitting element arranged on the lead frame exposed at the bottom of the recess, and an encapsulant filled in the recess. The package includes, at the side face where the lead frame protrudes, a first side face formed inwardly relative to a side face of the lead frame, and a second side face formed at a lower portion of the first side face and protruded so as to cover a top face of the lead frame.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre ; ger
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subjects ADVERTISING
BASIC ELECTRIC ELEMENTS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
PHYSICS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
title Semiconductor light emitting device and image display unit
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T17%3A51%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kurimoto,%20Takeo&rft.date=2018-09-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2416388B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true