APPARATUS AND METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT

The present invention relates to an apparatus for manufacturing an integrated circuit (10) having a thick film metal layer (14). A layer of metal paste (14) is applied via an application means (24) onto a heat-conducting substrate (12). The metal paste (14) includes metal particles of a predetermine...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DE WIJS, WILLEM-JAN, A, VAN DE SANDE, MARCUS, J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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