THREE-DIMENSIONAL NETWORK IN CMP PAD

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Bibliographische Detailangaben
Hauptverfasser:	JIN, MARC C, LEFEVRE, PAUL, WELLS, DAVID ADAM, HSU, OSCAR, K, ALDEBORGH, JOHN, ERIK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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