Circuit carrier with recess for receiving electronic components being contacted by a circuit board

The invention relates to an electronic module package comprised of a circuit carrier and a circuit board, as well as a method for manufacturing the electronic module package. To meet the high demands on portability of modern electronic products, the invention allows to significantly reduce the overall height of such electronic module package by providing a circuit carrier, which on the one hand is used as a fixture for at least one electronic module mounted thereon, and which on the other hand has formed at least one recess at the bottom side thereof. Upon the circuit carrier being mounted on the circuit board, the electronic components of the circuit board are then received by the at least one recess of the circuit carrier, thereby providing a flat shaped electronic module package. The electronic components enclosed by the at least one recess of the circuit carrier remain exclusively contacted by the circuit board at which the circuit carrier is mounted on.