METHOD FOR MANUFACTURING A PRINTED WIRING BOARD

Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring board 10 is characterized in that an insulation layer 16 is formed on either the top or bottom side of a metal core 11, whil...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOKOTA, Hideki, MIYAZAKI, Masashi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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