VAPOR DEVICE
A steam device includes a high-temperature member (1) and a low-temperature member (2). One surface of the high-temperature member (1) is exposed to high-temperature steam (3), and the other surface is cooled by cooling steam (4) having a temperature lower than the high-temperature steam (3). The lo...
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creator | WADA, KUNIHIKO SUGA, TAKEO SAITO, KAZUHIRO SUZUKI, YUSUKE IWAI, SHOGO YAMASHITA, KATSUYA INOMATA, ASAKO INUKAI, TAKAO ISHIWATA, YUTAKA NAKATANI, YUUJIRO |
description | A steam device includes a high-temperature member (1) and a low-temperature member (2). One surface of the high-temperature member (1) is exposed to high-temperature steam (3), and the other surface is cooled by cooling steam (4) having a temperature lower than the high-temperature steam (3). The low-temperature member (2) is disposed to face the high-temperature member (1) with a passage for the cooling steam (4) therebetween and is formed of a material having a heat resistance lower than that of the high-temperature member (1). The steam device has at least one high-reflectance, film selected from a first high-reflectance film (6), which is formed on the surface of the high-temperature member (1) which is exposed to the high-temperature steam (3) and has a higher reflectance with respect to infrared rays than the high-temperature member (1), and a second high-reflectance film (10), which is formed on the surface of the low-temperature member (2) facing the high-temperature member (1) and has a higher reflectance with respect to infrared rays than the low-temperature member (2). |
format | Patent |
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One surface of the high-temperature member (1) is exposed to high-temperature steam (3), and the other surface is cooled by cooling steam (4) having a temperature lower than the high-temperature steam (3). The low-temperature member (2) is disposed to face the high-temperature member (1) with a passage for the cooling steam (4) therebetween and is formed of a material having a heat resistance lower than that of the high-temperature member (1). The steam device has at least one high-reflectance, film selected from a first high-reflectance film (6), which is formed on the surface of the high-temperature member (1) which is exposed to the high-temperature steam (3) and has a higher reflectance with respect to infrared rays than the high-temperature member (1), and a second high-reflectance film (10), which is formed on the surface of the low-temperature member (2) facing the high-temperature member (1) and has a higher reflectance with respect to infrared rays than the low-temperature member (2).</description><language>eng ; fre ; ger</language><subject>BLASTING ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ENGINE PLANTS IN GENERAL ; HEATING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LIGHTING ; MACHINES OR ENGINES IN GENERAL ; MECHANICAL ENGINEERING ; METALLURGY ; NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES ; STEAM ENGINES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; WEAPONS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120606&DB=EPODOC&CC=EP&NR=2354472A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120606&DB=EPODOC&CC=EP&NR=2354472A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WADA, KUNIHIKO</creatorcontrib><creatorcontrib>SUGA, TAKEO</creatorcontrib><creatorcontrib>SAITO, KAZUHIRO</creatorcontrib><creatorcontrib>SUZUKI, YUSUKE</creatorcontrib><creatorcontrib>IWAI, SHOGO</creatorcontrib><creatorcontrib>YAMASHITA, KATSUYA</creatorcontrib><creatorcontrib>INOMATA, ASAKO</creatorcontrib><creatorcontrib>INUKAI, TAKAO</creatorcontrib><creatorcontrib>ISHIWATA, YUTAKA</creatorcontrib><creatorcontrib>NAKATANI, YUUJIRO</creatorcontrib><title>VAPOR DEVICE</title><description>A steam device includes a high-temperature member (1) and a low-temperature member (2). One surface of the high-temperature member (1) is exposed to high-temperature steam (3), and the other surface is cooled by cooling steam (4) having a temperature lower than the high-temperature steam (3). The low-temperature member (2) is disposed to face the high-temperature member (1) with a passage for the cooling steam (4) therebetween and is formed of a material having a heat resistance lower than that of the high-temperature member (1). The steam device has at least one high-reflectance, film selected from a first high-reflectance film (6), which is formed on the surface of the high-temperature member (1) which is exposed to the high-temperature steam (3) and has a higher reflectance with respect to infrared rays than the high-temperature member (1), and a second high-reflectance film (10), which is formed on the surface of the low-temperature member (2) facing the high-temperature member (1) and has a higher reflectance with respect to infrared rays than the low-temperature member (2).</description><subject>BLASTING</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ENGINE PLANTS IN GENERAL</subject><subject>HEATING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LIGHTING</subject><subject>MACHINES OR ENGINES IN GENERAL</subject><subject>MECHANICAL ENGINEERING</subject><subject>METALLURGY</subject><subject>NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES</subject><subject>STEAM ENGINES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAJcwzwD1JwcQ3zdHblYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGxqYmJuZGjibGRCgBAFQuG-8</recordid><startdate>20120606</startdate><enddate>20120606</enddate><creator>WADA, KUNIHIKO</creator><creator>SUGA, TAKEO</creator><creator>SAITO, KAZUHIRO</creator><creator>SUZUKI, YUSUKE</creator><creator>IWAI, SHOGO</creator><creator>YAMASHITA, KATSUYA</creator><creator>INOMATA, ASAKO</creator><creator>INUKAI, TAKAO</creator><creator>ISHIWATA, YUTAKA</creator><creator>NAKATANI, YUUJIRO</creator><scope>EVB</scope></search><sort><creationdate>20120606</creationdate><title>VAPOR DEVICE</title><author>WADA, KUNIHIKO ; SUGA, TAKEO ; SAITO, KAZUHIRO ; SUZUKI, YUSUKE ; IWAI, SHOGO ; YAMASHITA, KATSUYA ; INOMATA, ASAKO ; INUKAI, TAKAO ; ISHIWATA, YUTAKA ; NAKATANI, YUUJIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2354472A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2012</creationdate><topic>BLASTING</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ENGINE PLANTS IN GENERAL</topic><topic>HEATING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LIGHTING</topic><topic>MACHINES OR ENGINES IN GENERAL</topic><topic>MECHANICAL ENGINEERING</topic><topic>METALLURGY</topic><topic>NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES</topic><topic>STEAM ENGINES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>WADA, KUNIHIKO</creatorcontrib><creatorcontrib>SUGA, TAKEO</creatorcontrib><creatorcontrib>SAITO, KAZUHIRO</creatorcontrib><creatorcontrib>SUZUKI, YUSUKE</creatorcontrib><creatorcontrib>IWAI, SHOGO</creatorcontrib><creatorcontrib>YAMASHITA, KATSUYA</creatorcontrib><creatorcontrib>INOMATA, ASAKO</creatorcontrib><creatorcontrib>INUKAI, TAKAO</creatorcontrib><creatorcontrib>ISHIWATA, YUTAKA</creatorcontrib><creatorcontrib>NAKATANI, YUUJIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WADA, KUNIHIKO</au><au>SUGA, TAKEO</au><au>SAITO, KAZUHIRO</au><au>SUZUKI, YUSUKE</au><au>IWAI, SHOGO</au><au>YAMASHITA, KATSUYA</au><au>INOMATA, ASAKO</au><au>INUKAI, TAKAO</au><au>ISHIWATA, YUTAKA</au><au>NAKATANI, YUUJIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VAPOR DEVICE</title><date>2012-06-06</date><risdate>2012</risdate><abstract>A steam device includes a high-temperature member (1) and a low-temperature member (2). One surface of the high-temperature member (1) is exposed to high-temperature steam (3), and the other surface is cooled by cooling steam (4) having a temperature lower than the high-temperature steam (3). The low-temperature member (2) is disposed to face the high-temperature member (1) with a passage for the cooling steam (4) therebetween and is formed of a material having a heat resistance lower than that of the high-temperature member (1). The steam device has at least one high-reflectance, film selected from a first high-reflectance film (6), which is formed on the surface of the high-temperature member (1) which is exposed to the high-temperature steam (3) and has a higher reflectance with respect to infrared rays than the high-temperature member (1), and a second high-reflectance film (10), which is formed on the surface of the low-temperature member (2) facing the high-temperature member (1) and has a higher reflectance with respect to infrared rays than the low-temperature member (2).</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | BLASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ENGINE PLANTS IN GENERAL HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MACHINES OR ENGINES IN GENERAL MECHANICAL ENGINEERING METALLURGY NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES STEAM ENGINES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION WEAPONS |
title | VAPOR DEVICE |
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