GROUNDING SYSTEM AND APPARATUS

A grounding system for a semiconductor module (40) of a variable speed drive includes a first conductive layer (102), a second conductive layer (103); a substrate (110) disposed between the first conductive layer and the second conductive layer; a semiconductor device (112); and a base (104) attache...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ADIGA-MANOOR, Shreesha, BORISOV, Konstantin, JADRIC, Ivan, TODD, Michael, S
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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