OPTICAL COMMUNICATION MODULE

OPTICAL COMMUNICATION MODULE

To reduce a size of an optical communication module. There is provided an optical communication module 1, which includes a photoelectric conversion element package 10 to which a photoelectric conversion element 12 of either one of a light emitting element and a light receiving element is fitted so a...

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1. Verfasser: SAITOU, TAKAHITO
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Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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creator SAITOU, TAKAHITO
description To reduce a size of an optical communication module. There is provided an optical communication module 1, which includes a photoelectric conversion element package 10 to which a photoelectric conversion element 12 of either one of a light emitting element and a light receiving element is fitted so as to face one side 11a of a resin base 11, and an optical fiber coupler 20 having a light transmission hole 20c for coupling with an optical fiber in cylindrical portions 20a and 20b and mounted on the one side 11a of the resin base 11, where the photoelectric conversion element 12 and the light transmission hole 20c formed in the optical fiber coupler 20 are assembled aligned with an optical axis K. In the photoelectric conversion element package 10, the photoelectric conversion element 12 is fitted to the other side 11b opposite to the one side 11a of the resin base 11, and the photoelectric conversion element 12 is arranged at the center of a hole 11c bored through between the one side 11a and the other side 11b, aligned with the optical axis K.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2277069A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2277069A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2277069A13</originalsourceid><addsrcrecordid>eNrjZJDxDwjxdHb0UXD29_UN9QMyQzz9_RR8_V1CfVx5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CRkbm5gZmlo6ExEUoAQn8glQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OPTICAL COMMUNICATION MODULE</title><source>esp@cenet</source><creator>SAITOU, TAKAHITO</creator><creatorcontrib>SAITOU, TAKAHITO</creatorcontrib><description>To reduce a size of an optical communication module. There is provided an optical communication module 1, which includes a photoelectric conversion element package 10 to which a photoelectric conversion element 12 of either one of a light emitting element and a light receiving element is fitted so as to face one side 11a of a resin base 11, and an optical fiber coupler 20 having a light transmission hole 20c for coupling with an optical fiber in cylindrical portions 20a and 20b and mounted on the one side 11a of the resin base 11, where the photoelectric conversion element 12 and the light transmission hole 20c formed in the optical fiber coupler 20 are assembled aligned with an optical axis K. In the photoelectric conversion element package 10, the photoelectric conversion element 12 is fitted to the other side 11b opposite to the one side 11a of the resin base 11, and the photoelectric conversion element 12 is arranged at the center of a hole 11c bored through between the one side 11a and the other side 11b, aligned with the optical axis K.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110126&amp;DB=EPODOC&amp;CC=EP&amp;NR=2277069A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110126&amp;DB=EPODOC&amp;CC=EP&amp;NR=2277069A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAITOU, TAKAHITO</creatorcontrib><title>OPTICAL COMMUNICATION MODULE</title><description>To reduce a size of an optical communication module. There is provided an optical communication module 1, which includes a photoelectric conversion element package 10 to which a photoelectric conversion element 12 of either one of a light emitting element and a light receiving element is fitted so as to face one side 11a of a resin base 11, and an optical fiber coupler 20 having a light transmission hole 20c for coupling with an optical fiber in cylindrical portions 20a and 20b and mounted on the one side 11a of the resin base 11, where the photoelectric conversion element 12 and the light transmission hole 20c formed in the optical fiber coupler 20 are assembled aligned with an optical axis K. In the photoelectric conversion element package 10, the photoelectric conversion element 12 is fitted to the other side 11b opposite to the one side 11a of the resin base 11, and the photoelectric conversion element 12 is arranged at the center of a hole 11c bored through between the one side 11a and the other side 11b, aligned with the optical axis K.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDxDwjxdHb0UXD29_UN9QMyQzz9_RR8_V1CfVx5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4CRkbm5gZmlo6ExEUoAQn8glQ</recordid><startdate>20110126</startdate><enddate>20110126</enddate><creator>SAITOU, TAKAHITO</creator><scope>EVB</scope></search><sort><creationdate>20110126</creationdate><title>OPTICAL COMMUNICATION MODULE</title><author>SAITOU, TAKAHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2277069A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAITOU, TAKAHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAITOU, TAKAHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL COMMUNICATION MODULE</title><date>2011-01-26</date><risdate>2011</risdate><abstract>To reduce a size of an optical communication module. There is provided an optical communication module 1, which includes a photoelectric conversion element package 10 to which a photoelectric conversion element 12 of either one of a light emitting element and a light receiving element is fitted so as to face one side 11a of a resin base 11, and an optical fiber coupler 20 having a light transmission hole 20c for coupling with an optical fiber in cylindrical portions 20a and 20b and mounted on the one side 11a of the resin base 11, where the photoelectric conversion element 12 and the light transmission hole 20c formed in the optical fiber coupler 20 are assembled aligned with an optical axis K. In the photoelectric conversion element package 10, the photoelectric conversion element 12 is fitted to the other side 11b opposite to the one side 11a of the resin base 11, and the photoelectric conversion element 12 is arranged at the center of a hole 11c bored through between the one side 11a and the other side 11b, aligned with the optical axis K.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
title OPTICAL COMMUNICATION MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T06%3A18%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAITOU,%20TAKAHITO&rft.date=2011-01-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2277069A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true