REFLOW SOLDER FURNACE AND METHOD FOR REFLOW SOLDERING

A reflow soldering furnace and a method for reflow soldering of components (3) disposed on a circuit board (1) in a reflow soldering furnace is described, in which the temperature of the solder points (5) of the individual components (3) distributed over the circuit board (1) follows as precise a ta...

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Bibliographische Detailangaben
Hauptverfasser:	HIPPIN, CHRISTOPH, GLATZ, FRANZ, BIRGEL, DIETMAR
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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