ANTENNA CIRCUIT CONFIGURING BODY FOR IC CARD/TAG, AND IC CARD
Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) mad...
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| creator | EGASHIRA, KIYOJI SHINGU, AKIRA |
| description | Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) made of the resin film; and circuit pattern layers (131 and 132) each formed on each of both sides of the base material (11) and made of aluminum foil. The circuit pattern layer (131) includes a coiled pattern layer. Parts of the circuit pattern layers (131 and 132), which mutually face each other; and a part of the base material (11), which is interposed between the parts of the circuit pattern layers (131 and 132), constitute a capacitor. The circuit pattern layers (131 and 132) are electrically connected by means of crimping parts (13a and 13b). The base material (11) includes a plurality of void-state-air layers. A relative density of the base material (11) with respect to a density of a resin is less than or equal to 0.9. An average volume of the void-state-air layers is greater than or equal to 2 µm 3 and less than or equal to 90 µm 3 . |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2276113A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2276113A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2276113A13</originalsourceid><addsrcrecordid>eNrjZLB19Atx9fNzVHD2DHIO9QxRcPb3c_N0Dw3y9HNXcPJ3iVRw8w9S8HRWcHYMctEPcXTXUXD0c4EJ8DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAIyNzM0NDY0dDYyKUAACOQCiW</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ANTENNA CIRCUIT CONFIGURING BODY FOR IC CARD/TAG, AND IC CARD</title><source>esp@cenet</source><creator>EGASHIRA, KIYOJI ; SHINGU, AKIRA</creator><creatorcontrib>EGASHIRA, KIYOJI ; SHINGU, AKIRA</creatorcontrib><description>Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) made of the resin film; and circuit pattern layers (131 and 132) each formed on each of both sides of the base material (11) and made of aluminum foil. The circuit pattern layer (131) includes a coiled pattern layer. Parts of the circuit pattern layers (131 and 132), which mutually face each other; and a part of the base material (11), which is interposed between the parts of the circuit pattern layers (131 and 132), constitute a capacitor. The circuit pattern layers (131 and 132) are electrically connected by means of crimping parts (13a and 13b). The base material (11) includes a plurality of void-state-air layers. A relative density of the base material (11) with respect to a density of a resin is less than or equal to 0.9. An average volume of the void-state-air layers is greater than or equal to 2 µm 3 and less than or equal to 90 µm 3 .</description><language>eng ; fre ; ger</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING RECORD CARRIERS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRESENTATION OF DATA ; PRINTED CIRCUITS ; RECOGNITION OF DATA ; RECORD CARRIERS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110119&DB=EPODOC&CC=EP&NR=2276113A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110119&DB=EPODOC&CC=EP&NR=2276113A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>EGASHIRA, KIYOJI</creatorcontrib><creatorcontrib>SHINGU, AKIRA</creatorcontrib><title>ANTENNA CIRCUIT CONFIGURING BODY FOR IC CARD/TAG, AND IC CARD</title><description>Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) made of the resin film; and circuit pattern layers (131 and 132) each formed on each of both sides of the base material (11) and made of aluminum foil. The circuit pattern layer (131) includes a coiled pattern layer. Parts of the circuit pattern layers (131 and 132), which mutually face each other; and a part of the base material (11), which is interposed between the parts of the circuit pattern layers (131 and 132), constitute a capacitor. The circuit pattern layers (131 and 132) are electrically connected by means of crimping parts (13a and 13b). The base material (11) includes a plurality of void-state-air layers. A relative density of the base material (11) with respect to a density of a resin is less than or equal to 0.9. An average volume of the void-state-air layers is greater than or equal to 2 µm 3 and less than or equal to 90 µm 3 .</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING RECORD CARRIERS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED CIRCUITS</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB19Atx9fNzVHD2DHIO9QxRcPb3c_N0Dw3y9HNXcPJ3iVRw8w9S8HRWcHYMctEPcXTXUXD0c4EJ8DCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAIyNzM0NDY0dDYyKUAACOQCiW</recordid><startdate>20110119</startdate><enddate>20110119</enddate><creator>EGASHIRA, KIYOJI</creator><creator>SHINGU, AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20110119</creationdate><title>ANTENNA CIRCUIT CONFIGURING BODY FOR IC CARD/TAG, AND IC CARD</title><author>EGASHIRA, KIYOJI ; SHINGU, AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2276113A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2011</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING RECORD CARRIERS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED CIRCUITS</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><toplevel>online_resources</toplevel><creatorcontrib>EGASHIRA, KIYOJI</creatorcontrib><creatorcontrib>SHINGU, AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>EGASHIRA, KIYOJI</au><au>SHINGU, AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ANTENNA CIRCUIT CONFIGURING BODY FOR IC CARD/TAG, AND IC CARD</title><date>2011-01-19</date><risdate>2011</risdate><abstract>Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) made of the resin film; and circuit pattern layers (131 and 132) each formed on each of both sides of the base material (11) and made of aluminum foil. The circuit pattern layer (131) includes a coiled pattern layer. Parts of the circuit pattern layers (131 and 132), which mutually face each other; and a part of the base material (11), which is interposed between the parts of the circuit pattern layers (131 and 132), constitute a capacitor. The circuit pattern layers (131 and 132) are electrically connected by means of crimping parts (13a and 13b). The base material (11) includes a plurality of void-state-air layers. A relative density of the base material (11) with respect to a density of a resin is less than or equal to 0.9. An average volume of the void-state-air layers is greater than or equal to 2 µm 3 and less than or equal to 90 µm 3 .</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS RECOGNITION OF DATA RECORD CARRIERS |
| title | ANTENNA CIRCUIT CONFIGURING BODY FOR IC CARD/TAG, AND IC CARD |
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