THERMALLY-ACTIVATED AND HARDENABLE ADHESIVE FOIL, ESPECIALLY FOR ADHESION OF ELECTRONIC COMPONENTS AND FLEXIBLE PRINTED CIRCUIT PATHS

THERMALLY-ACTIVATED AND HARDENABLE ADHESIVE FOIL, ESPECIALLY FOR ADHESION OF ELECTRONIC COMPONENTS AND FLEXIBLE PRINTED CIRCUIT PATHS

Thermally-activated and hardenable adhesive foil for adhesion of electronic components and flexible printed circuit paths having an adhesive material composed of at least a) one chemically crosslinked or at least partially crosslinked polyurethane, b) one at least bifunctional epoxy resin, c) one ha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: STEEN, ALEXANDER, SCHUEMANN, UWE
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:Thermally-activated and hardenable adhesive foil for adhesion of electronic components and flexible printed circuit paths having an adhesive material composed of at least a) one chemically crosslinked or at least partially crosslinked polyurethane, b) one at least bifunctional epoxy resin, c) one hardener for the epoxy resin, in which the epoxy groups react chemically with the hardener at high temperatures, in which at least one of the starting materials of the polyurethane is a hydroxyl-functionalized polycarbonate and at least one of the starting materials of the polyurethane has a functionality greater than two