METHODS AND APPARATUS FOR HEAT TRANSFER FOR A COMPONENT

Methods and apparatus for transferring heat according to various aspects of the present invention operate in conjunction with a heat source on a substrate. In one embodiment, a lid is adapted to engage the substrate. The lid may comprise a thermally conductive rigid body and one or more hardstops co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KONEN, CYNTHIA, R, MYERS, JAMES, R, PETERSON, STEVEN, N, FAORO, JAMES, E, ROCHE-RIOS, ISIS, CUNNINGTON, GEORGE, R, PAULSON, KEVIN, A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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