Adhesive tape, in particular for gluing photovoltaic modules

The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZMARSLY, FRANZISKA, BURMEISTER, AXEL, UTESCH, NILS DR
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ZMARSLY, FRANZISKA
BURMEISTER, AXEL
UTESCH, NILS DR
description The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The adhesive layers form a top and a bottom adhesive layer. The polymer layer has a layer of 100-3000 mu m after foaming, is foamed by application of heat, undergoes a volume increase of 30%, The adhesive tape is introduced into the frame during the production of the extrusion of the frame, and is separated to the desired length. The barrier layer forms the carrier. The polymer layer is heated to 150[deg] C.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2226851A3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2226851A3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2226851A33</originalsourceid><addsrcrecordid>eNrjZLBxTMlILc4sS1UoSSxI1VHIzFMoSCwqyUwuzUksUkjLL1JIzynNzEtXKMjIL8kvy88pScxMVsjNTynNSS3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGRkZmFqaGjsbGRCgBAI8EL5I</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Adhesive tape, in particular for gluing photovoltaic modules</title><source>esp@cenet</source><creator>ZMARSLY, FRANZISKA ; BURMEISTER, AXEL ; UTESCH, NILS DR</creator><creatorcontrib>ZMARSLY, FRANZISKA ; BURMEISTER, AXEL ; UTESCH, NILS DR</creatorcontrib><description>The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The adhesive layers form a top and a bottom adhesive layer. The polymer layer has a layer of 100-3000 mu m after foaming, is foamed by application of heat, undergoes a volume increase of 30%, The adhesive tape is introduced into the frame during the production of the extrusion of the frame, and is separated to the desired length. The barrier layer forms the carrier. The polymer layer is heated to 150[deg] C.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120307&amp;DB=EPODOC&amp;CC=EP&amp;NR=2226851A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120307&amp;DB=EPODOC&amp;CC=EP&amp;NR=2226851A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZMARSLY, FRANZISKA</creatorcontrib><creatorcontrib>BURMEISTER, AXEL</creatorcontrib><creatorcontrib>UTESCH, NILS DR</creatorcontrib><title>Adhesive tape, in particular for gluing photovoltaic modules</title><description>The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The adhesive layers form a top and a bottom adhesive layer. The polymer layer has a layer of 100-3000 mu m after foaming, is foamed by application of heat, undergoes a volume increase of 30%, The adhesive tape is introduced into the frame during the production of the extrusion of the frame, and is separated to the desired length. The barrier layer forms the carrier. The polymer layer is heated to 150[deg] C.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxTMlILc4sS1UoSSxI1VHIzFMoSCwqyUwuzUksUkjLL1JIzynNzEtXKMjIL8kvy88pScxMVsjNTynNSS3mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGRkZmFqaGjsbGRCgBAI8EL5I</recordid><startdate>20120307</startdate><enddate>20120307</enddate><creator>ZMARSLY, FRANZISKA</creator><creator>BURMEISTER, AXEL</creator><creator>UTESCH, NILS DR</creator><scope>EVB</scope></search><sort><creationdate>20120307</creationdate><title>Adhesive tape, in particular for gluing photovoltaic modules</title><author>ZMARSLY, FRANZISKA ; BURMEISTER, AXEL ; UTESCH, NILS DR</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2226851A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2012</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZMARSLY, FRANZISKA</creatorcontrib><creatorcontrib>BURMEISTER, AXEL</creatorcontrib><creatorcontrib>UTESCH, NILS DR</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZMARSLY, FRANZISKA</au><au>BURMEISTER, AXEL</au><au>UTESCH, NILS DR</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Adhesive tape, in particular for gluing photovoltaic modules</title><date>2012-03-07</date><risdate>2012</risdate><abstract>The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The method for the adhesive bonding of a photovoltaic laminate (3) in a frame (2) of a photovoltaic module, comprises bonding the photovoltaic laminate in the frame of the module with an adhesive tape (1) having two adhesive layers and a polymer layer comprising a foaming agent. The adhesive layer is formed as the polymer layer comprising the foaming agent, and comprises a moisture-crosslinking, silylated, pressure-sensitive polyurethane adhesive. The adhesive tape further comprises a barrier layer, a carrier or both a barrier layer and a carrier. The adhesive layers form a top and a bottom adhesive layer. The polymer layer has a layer of 100-3000 mu m after foaming, is foamed by application of heat, undergoes a volume increase of 30%, The adhesive tape is introduced into the frame during the production of the extrusion of the frame, and is separated to the desired length. The barrier layer forms the carrier. The polymer layer is heated to 150[deg] C.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP2226851A3
source esp@cenet
subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
title Adhesive tape, in particular for gluing photovoltaic modules
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T04%3A48%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZMARSLY,%20FRANZISKA&rft.date=2012-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2226851A3%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true