Device for capturing and removing thin workpiece strips and profiling machine with such a device
The device has a suction pipe (1), which is connected with suction devices e.g. vacuum chamber (4) and vacuum pump (6), and is brought in direct proximity with a region of an in-line production system. Thin workpiece strips (17) are cut in the in-line production system. The suction pipe is connected...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!