METHOD FOR FORMING ELECROCONDUCTIVE THIN LINE

The object underlying the present invention is the provision of a method for forming a high-definition electroconductive thin line free from blurring at low cost. This is accomplished by a method for forming an electroconductive thin line on the surface of a resin base material comprising the following steps: A resin film having a hardness of 20 to 70, as measured by a type A measuring method specified in JIS K 6253, is formed on a surface of a resin base material. A thin line pattern is formed on the resin film by intaglio printing or stencil printing, preferably using an electroconductive paste. In the alternative, an electroless plating catalyst ink can be used. Subsequently, a metal film can be formed on the thin line pattern by plating to form an electroconductive thin line.