METHOD FOR THE PRODUCTION OF A CIRCUIT BOARD LAYER (CIRCUIT PLANE) FOR A PARTICULARLY MULTI-LAYER CIRCUIT BOARD (CERAMIC SUBSTRATE)

A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SENTUERK, TUNCAY, TAUBER, PETER, SPEH, ULRICH
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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