METHOD FOR FABRICATING AN LED PACKAGE

A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is dispos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEO, EUN JUNG, KIM, YOON HEE, LEE, CHUNG HOON, PARK, BYUNG YEOL, KIM, BANG HYUN, KWON, HYOUK WON
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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