Method And Apparatus For Cooling Electronics
Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink (10) to provide increased cooling for electronic equipment, such as power converters (52). In one embodiment, a heatsink (10) includes at least one fluid cooled portion (...
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| creator | EDMUNDS, HOWARD MCFALLS, RICHARD KENNETH |
| description | Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink (10) to provide increased cooling for electronic equipment, such as power converters (52). In one embodiment, a heatsink (10) includes at least one fluid cooled portion (20) and at least one heat pipe (24) disposed adjacent to the fluid cooled portion (20). The heat pipe (24) improves the conduction of heat away from heat sources. |
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In one embodiment, a heatsink (10) includes at least one fluid cooled portion (20) and at least one heat pipe (24) disposed adjacent to the fluid cooled portion (20). The heat pipe (24) improves the conduction of heat away from heat sources.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100602&DB=EPODOC&CC=EP&NR=2192827A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100602&DB=EPODOC&CC=EP&NR=2192827A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>EDMUNDS, HOWARD</creatorcontrib><creatorcontrib>MCFALLS, RICHARD KENNETH</creatorcontrib><title>Method And Apparatus For Cooling Electronics</title><description>Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink (10) to provide increased cooling for electronic equipment, such as power converters (52). 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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | Method And Apparatus For Cooling Electronics |
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