Circuit member connecting structure

The present invention is a circuit connecting material (10) used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member (30) in which electrodes (32) and insulating layers (33) are form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ARIFUKU, MOTOHIRO, WATANABE, ITSUO, KOBAYASHI, KOUJI, GOTOU, YASUSHI, KOJIMA, KAZUYOSHI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is a circuit connecting material (10) used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member (30) in which electrodes (32) and insulating layers (33) are formed adjacent to each other on the surface (31a) of a board (31), with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition (11) and conductive particles (12) that have a mean particle size of 1 µm or greater but less than 10 µm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40°C and a mean coefficient of thermal expansion of 30 to 200 ppm/°C at from 25°C to 100°C when subjected to the curing treatment.