REDUCED CYCLE TIME MANUFACTURING PROCESSES FOR THICK FILM RESISTIVE DEVICES

A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is lam...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FORBIS, LARRY, PRIVETT, ANGIE, BRUMMELL, ROGER
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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