REDUCED CYCLE TIME MANUFACTURING PROCESSES FOR THICK FILM RESISTIVE DEVICES

A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is lam...

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Hauptverfasser: FORBIS, LARRY, PRIVETT, ANGIE, BRUMMELL, ROGER
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Sprache:eng ; fre ; ger
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creator FORBIS, LARRY
PRIVETT, ANGIE
BRUMMELL, ROGER
description A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time. A resistive layer is formed on the dielectric layer after the dielectric tape is laminated to the substrate. A protective layer is formed over the resistive layer.
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language eng ; fre ; ger
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source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
RESISTORS
TRANSPORTING
title REDUCED CYCLE TIME MANUFACTURING PROCESSES FOR THICK FILM RESISTIVE DEVICES
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