Electronic module with heat sink

An electronic module includes a printed circuit board (24) with a heat producing electrical component (26) assembled in an insulating housing (12). The component is adjacent a thermally conducting heat sink (30) with a thermally conductive material (32) disposed therebetween. Integral with the heat...

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Hauptverfasser:	WILSON, SCOTT E, KRISHNAN, G. VENKATA, HINZE, LEE R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	WILSON, SCOTT E KRISHNAN, G. VENKATA HINZE, LEE R
description	An electronic module includes a printed circuit board (24) with a heat producing electrical component (26) assembled in an insulating housing (12). The component is adjacent a thermally conducting heat sink (30) with a thermally conductive material (32) disposed therebetween. Integral with the heat sink is a thermally conductive runner (38), partially encased in the housing wall, connecting the heat sink to a thermally conductive port (22). The port is coupled to a base structure when the housing is attached to the base (14), forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.
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language	eng ; fre ; ger
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	Electronic module with heat sink
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