METHOD OF JOINING DISSIMILAR METALLIC MATERIALS

Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKURAI, Hiroshi, NAKAGAWA, Shigeyuki, YANAGIDA, Sadao, FUKUSHIMA, Akira, SUGI, Chika
Format: Patent
Sprache:eng ; fre ; ger
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