Electronic component package and method of manufacturing the same

There is provided an electronic component package (10). The electronic component package includes: a core layer (11) including a plurality of insulating layers formed by impregnating a base material with a resin, wherein a hollow portion is formed in the core layer; core wiring layers (12a, 12b) eac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKENOUCHI, TAKAHIRO, SHIMIZU, HIROSHI, KATO, HIROYUKI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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