ELECTRICAL INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first elect...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAH, JAE-WOONG, SHIH, DA-YUAN, BUCHWALTER, STEPHEN, LESLIE, GRUBER, PETER, ALFRED, FURMAN, BRUCE, KENNETH
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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