Circuit board partition device

The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GOEDECKE, WOLF-DIETER, LORENZ, STEFAN, HEILMANN, MATTHIAS, ROSENFELDER, FRANK
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator GOEDECKE, WOLF-DIETER
LORENZ, STEFAN
HEILMANN, MATTHIAS
ROSENFELDER, FRANK
description The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32). The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32) for holding and supporting elements and the separation device is equipped with a gripper by which the holding or supporting elements are removed from the reception and are positionable on the basic base. The removing and positioning of the supporting elements is carried out in numerically controllable manner. The holding or supporting elements have a rejuvenating gripping or centering means by which it grips the circuit board substrate in the gripping or centering means. A permanent magnet is integrated in to the holding or supporting element or in the foot section of the holding or supporting elements. The basic base is formed from iron or iron containing and/or magnetic or magnetizable material. The reception is arranged on the basic base. The holding or supporting elements are equipped in the form of side stop means for positioning or referencing the substrate on the workpiece carriers that are magnetically fixable, are equipped vertically to the circuit board plain over the substrate and are applied in the plain of the substrate externally against the substrate. The side stop element has a graduation or slit-like groove stretching parallel to the plain of the basic base in which an edge of the substrate grips and the substrate is fixable in vertical direction to the workpiece
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2127800B9</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2127800B9</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2127800B93</originalsourceid><addsrcrecordid>eNrjZJBzzixKLs0sUUjKTyxKUShILCrJLMnMz1NISS3LTE7lYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGhkbmFgYGTpbGRCgBALeoJCw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit board partition device</title><source>esp@cenet</source><creator>GOEDECKE, WOLF-DIETER ; LORENZ, STEFAN ; HEILMANN, MATTHIAS ; ROSENFELDER, FRANK</creator><creatorcontrib>GOEDECKE, WOLF-DIETER ; LORENZ, STEFAN ; HEILMANN, MATTHIAS ; ROSENFELDER, FRANK</creatorcontrib><description>The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32). The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32) for holding and supporting elements and the separation device is equipped with a gripper by which the holding or supporting elements are removed from the reception and are positionable on the basic base. The removing and positioning of the supporting elements is carried out in numerically controllable manner. The holding or supporting elements have a rejuvenating gripping or centering means by which it grips the circuit board substrate in the gripping or centering means. A permanent magnet is integrated in to the holding or supporting element or in the foot section of the holding or supporting elements. The basic base is formed from iron or iron containing and/or magnetic or magnetizable material. The reception is arranged on the basic base. The holding or supporting elements are equipped in the form of side stop means for positioning or referencing the substrate on the workpiece carriers that are magnetically fixable, are equipped vertically to the circuit board plain over the substrate and are applied in the plain of the substrate externally against the substrate. The side stop element has a graduation or slit-like groove stretching parallel to the plain of the basic base in which an edge of the substrate grips and the substrate is fixable in vertical direction to the workpiece carrier. For positioning and referencing the substrate, two first holding or supporting elements are equipped with the gripping or centering means and the two second holding or supporting elements are equipped with the gripping or centering means. The gripping or centering means of the first holding or supporting means are intended in Z-direction as the second elements. The first holding or supporting elements have a pre-positioning and the second holding or supporting elements have a final fine positioning. The holding or supporting elements are arranged simultaneously on the foot section and have a slight interval than the dimension of the foot sections in the plain of the basic base. A mounting program is mounted for the reception and positioning of the holding or supporting elements in a programmable control device. The gripper comprises a sleeve that is put over the respective holding or supporting element, which is magnetically fixable in the sleeve so that it grips and is manageable. The separation device comprises a chip lining for a tool for milling in which the gripper is introduced for carrying out the mounting process. An independent claim is included for a method for operating a circuit board divider.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HAND TOOLS ; MACHINE TOOLS ; MANIPULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PORTABLE POWER-DRIVEN TOOLS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130529&amp;DB=EPODOC&amp;CC=EP&amp;NR=2127800B9$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130529&amp;DB=EPODOC&amp;CC=EP&amp;NR=2127800B9$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOEDECKE, WOLF-DIETER</creatorcontrib><creatorcontrib>LORENZ, STEFAN</creatorcontrib><creatorcontrib>HEILMANN, MATTHIAS</creatorcontrib><creatorcontrib>ROSENFELDER, FRANK</creatorcontrib><title>Circuit board partition device</title><description>The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32). The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32) for holding and supporting elements and the separation device is equipped with a gripper by which the holding or supporting elements are removed from the reception and are positionable on the basic base. The removing and positioning of the supporting elements is carried out in numerically controllable manner. The holding or supporting elements have a rejuvenating gripping or centering means by which it grips the circuit board substrate in the gripping or centering means. A permanent magnet is integrated in to the holding or supporting element or in the foot section of the holding or supporting elements. The basic base is formed from iron or iron containing and/or magnetic or magnetizable material. The reception is arranged on the basic base. The holding or supporting elements are equipped in the form of side stop means for positioning or referencing the substrate on the workpiece carriers that are magnetically fixable, are equipped vertically to the circuit board plain over the substrate and are applied in the plain of the substrate externally against the substrate. The side stop element has a graduation or slit-like groove stretching parallel to the plain of the basic base in which an edge of the substrate grips and the substrate is fixable in vertical direction to the workpiece carrier. For positioning and referencing the substrate, two first holding or supporting elements are equipped with the gripping or centering means and the two second holding or supporting elements are equipped with the gripping or centering means. The gripping or centering means of the first holding or supporting means are intended in Z-direction as the second elements. The first holding or supporting elements have a pre-positioning and the second holding or supporting elements have a final fine positioning. The holding or supporting elements are arranged simultaneously on the foot section and have a slight interval than the dimension of the foot sections in the plain of the basic base. A mounting program is mounted for the reception and positioning of the holding or supporting elements in a programmable control device. The gripper comprises a sleeve that is put over the respective holding or supporting element, which is magnetically fixable in the sleeve so that it grips and is manageable. The separation device comprises a chip lining for a tool for milling in which the gripper is introduced for carrying out the mounting process. An independent claim is included for a method for operating a circuit board divider.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HAND TOOLS</subject><subject>MACHINE TOOLS</subject><subject>MANIPULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PORTABLE POWER-DRIVEN TOOLS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBzzixKLs0sUUjKTyxKUShILCrJLMnMz1NISS3LTE7lYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGhkbmFgYGTpbGRCgBALeoJCw</recordid><startdate>20130529</startdate><enddate>20130529</enddate><creator>GOEDECKE, WOLF-DIETER</creator><creator>LORENZ, STEFAN</creator><creator>HEILMANN, MATTHIAS</creator><creator>ROSENFELDER, FRANK</creator><scope>EVB</scope></search><sort><creationdate>20130529</creationdate><title>Circuit board partition device</title><author>GOEDECKE, WOLF-DIETER ; LORENZ, STEFAN ; HEILMANN, MATTHIAS ; ROSENFELDER, FRANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2127800B93</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HAND TOOLS</topic><topic>MACHINE TOOLS</topic><topic>MANIPULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PORTABLE POWER-DRIVEN TOOLS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>GOEDECKE, WOLF-DIETER</creatorcontrib><creatorcontrib>LORENZ, STEFAN</creatorcontrib><creatorcontrib>HEILMANN, MATTHIAS</creatorcontrib><creatorcontrib>ROSENFELDER, FRANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOEDECKE, WOLF-DIETER</au><au>LORENZ, STEFAN</au><au>HEILMANN, MATTHIAS</au><au>ROSENFELDER, FRANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit board partition device</title><date>2013-05-29</date><risdate>2013</risdate><abstract>The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32). The circuit board divider comprises a mechanically influencing or laser based numerically controllable separation device, and a workpiece carrier. The circuit board substrate (4) and the circuit board (5) are held in a course during the separation process of the workpiece carrier. The workpiece carrier comprises a basic base (28) and magnetic holding or supporting element (26) cooperating with the basic base for the guiding plate substrate. A foot section of the holding or supporting element cooperates magnetically with the basic base. The workpiece carrier has a magazine-like reception (32) for holding and supporting elements and the separation device is equipped with a gripper by which the holding or supporting elements are removed from the reception and are positionable on the basic base. The removing and positioning of the supporting elements is carried out in numerically controllable manner. The holding or supporting elements have a rejuvenating gripping or centering means by which it grips the circuit board substrate in the gripping or centering means. A permanent magnet is integrated in to the holding or supporting element or in the foot section of the holding or supporting elements. The basic base is formed from iron or iron containing and/or magnetic or magnetizable material. The reception is arranged on the basic base. The holding or supporting elements are equipped in the form of side stop means for positioning or referencing the substrate on the workpiece carriers that are magnetically fixable, are equipped vertically to the circuit board plain over the substrate and are applied in the plain of the substrate externally against the substrate. The side stop element has a graduation or slit-like groove stretching parallel to the plain of the basic base in which an edge of the substrate grips and the substrate is fixable in vertical direction to the workpiece carrier. For positioning and referencing the substrate, two first holding or supporting elements are equipped with the gripping or centering means and the two second holding or supporting elements are equipped with the gripping or centering means. The gripping or centering means of the first holding or supporting means are intended in Z-direction as the second elements. The first holding or supporting elements have a pre-positioning and the second holding or supporting elements have a final fine positioning. The holding or supporting elements are arranged simultaneously on the foot section and have a slight interval than the dimension of the foot sections in the plain of the basic base. A mounting program is mounted for the reception and positioning of the holding or supporting elements in a programmable control device. The gripper comprises a sleeve that is put over the respective holding or supporting element, which is magnetically fixable in the sleeve so that it grips and is manageable. The separation device comprises a chip lining for a tool for milling in which the gripper is introduced for carrying out the mounting process. An independent claim is included for a method for operating a circuit board divider.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP2127800B9
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MACHINE TOOLS
MANIPULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Circuit board partition device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T04%3A20%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GOEDECKE,%20WOLF-DIETER&rft.date=2013-05-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2127800B9%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true