EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF

EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF

A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second co...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DIRKS, PETER, HERES, KLAAS
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator DIRKS, PETER
HERES, KLAAS
description A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second conductive layer (106; 504), forming an inductor and contact pads for the chip by patterning the first conductive layer (104; 503) from the first side of the carrier (102; 202; 302), assembling the chip and providing an encapsulation (514) and forming terminals of the package, by patterning the second conductive layer (106; 504) from the second side of the carrier.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2115774A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2115774A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2115774A23</originalsourceid><addsrcrecordid>eNrjZDB09XVydXFxdVHw9HMJdQ7xD1Jw9HNR8HUN8fB3UfB3UwgI8geKe_q5K4R4uAa5-rvxMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wAjQ0NTc3MTRyNjIpQAAOtPJes</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF</title><source>esp@cenet</source><creator>DIRKS, PETER ; HERES, KLAAS</creator><creatorcontrib>DIRKS, PETER ; HERES, KLAAS</creatorcontrib><description>A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second conductive layer (106; 504), forming an inductor and contact pads for the chip by patterning the first conductive layer (104; 503) from the first side of the carrier (102; 202; 302), assembling the chip and providing an encapsulation (514) and forming terminals of the package, by patterning the second conductive layer (106; 504) from the second side of the carrier.</description><language>eng ; fre ; ger</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; SEMICONDUCTOR DEVICES ; TRANSFORMERS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20091111&amp;DB=EPODOC&amp;CC=EP&amp;NR=2115774A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20091111&amp;DB=EPODOC&amp;CC=EP&amp;NR=2115774A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DIRKS, PETER</creatorcontrib><creatorcontrib>HERES, KLAAS</creatorcontrib><title>EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF</title><description>A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second conductive layer (106; 504), forming an inductor and contact pads for the chip by patterning the first conductive layer (104; 503) from the first side of the carrier (102; 202; 302), assembling the chip and providing an encapsulation (514) and forming terminals of the package, by patterning the second conductive layer (106; 504) from the second side of the carrier.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB09XVydXFxdVHw9HMJdQ7xD1Jw9HNR8HUN8fB3UfB3UwgI8geKe_q5K4R4uAa5-rvxMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wAjQ0NTc3MTRyNjIpQAAOtPJes</recordid><startdate>20091111</startdate><enddate>20091111</enddate><creator>DIRKS, PETER</creator><creator>HERES, KLAAS</creator><scope>EVB</scope></search><sort><creationdate>20091111</creationdate><title>EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF</title><author>DIRKS, PETER ; HERES, KLAAS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2115774A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2009</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>DIRKS, PETER</creatorcontrib><creatorcontrib>HERES, KLAAS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DIRKS, PETER</au><au>HERES, KLAAS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF</title><date>2009-11-11</date><risdate>2009</risdate><abstract>A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second conductive layer (106; 504), forming an inductor and contact pads for the chip by patterning the first conductive layer (104; 503) from the first side of the carrier (102; 202; 302), assembling the chip and providing an encapsulation (514) and forming terminals of the package, by patterning the second conductive layer (106; 504) from the second side of the carrier.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP2115774A2
source esp@cenet
subjects ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
title EMBEDDED INDUCTOR AND METHOD OF PRODUCING THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T17%3A59%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=DIRKS,%20PETER&rft.date=2009-11-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2115774A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true