Electrical connection through a substrate to a microelectromechanical device
An electrical through-connection, or via, that passes through a substrate (22) to a bus (28) on a first surface (21) of the substrate (22). The via may be configured with an interlock (46) such that the electrically conductive core (60) of the via is constrained to thermally expand towards the secon...
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| creator | CLAYDON, GLENN SCOTT HAYS, DAVID CECIL AIMI, MARCO FRANCESCO BOOMHOWER, OLIVER CHARLES SUBRAMANIAN, KANAKASABAPATHI KEIMEL, CHRISTOPHER FRED |
| description | An electrical through-connection, or via, that passes through a substrate (22) to a bus (28) on a first surface (21) of the substrate (22). The via may be configured with an interlock (46) such that the electrically conductive core (60) of the via is constrained to thermally expand towards the second surface (23), away from the bus (28), thus preventing damage to the bus (28). The interlock (46) may be a local constriction or enlargement of the via near the first surface (21) of the substrate (22). The via may be greater in length along the bus (28) than a unit spacing of beams (30) in a parallel microswitch array (20) actuated in unison along the bus (28). The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface (23) of the substrate (22) than at the first surface (21). |
| format | Patent |
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The via may be configured with an interlock (46) such that the electrically conductive core (60) of the via is constrained to thermally expand towards the second surface (23), away from the bus (28), thus preventing damage to the bus (28). The interlock (46) may be a local constriction or enlargement of the via near the first surface (21) of the substrate (22). The via may be greater in length along the bus (28) than a unit spacing of beams (30) in a parallel microswitch array (20) actuated in unison along the bus (28). The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface (23) of the substrate (22) than at the first surface (21).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SWITCHES ; ELECTRICITY ; EMERGENCY PROTECTIVE DEVICES ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; RELAYS ; SELECTORS ; TRANSPORTING</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090429&DB=EPODOC&CC=EP&NR=2053017A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090429&DB=EPODOC&CC=EP&NR=2053017A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CLAYDON, GLENN SCOTT</creatorcontrib><creatorcontrib>HAYS, DAVID CECIL</creatorcontrib><creatorcontrib>AIMI, MARCO FRANCESCO</creatorcontrib><creatorcontrib>BOOMHOWER, OLIVER CHARLES</creatorcontrib><creatorcontrib>SUBRAMANIAN, KANAKASABAPATHI</creatorcontrib><creatorcontrib>KEIMEL, CHRISTOPHER FRED</creatorcontrib><title>Electrical connection through a substrate to a microelectromechanical device</title><description>An electrical through-connection, or via, that passes through a substrate (22) to a bus (28) on a first surface (21) of the substrate (22). 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The via may be configured with an interlock (46) such that the electrically conductive core (60) of the via is constrained to thermally expand towards the second surface (23), away from the bus (28), thus preventing damage to the bus (28). The interlock (46) may be a local constriction or enlargement of the via near the first surface (21) of the substrate (22). The via may be greater in length along the bus (28) than a unit spacing of beams (30) in a parallel microswitch array (20) actuated in unison along the bus (28). The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface (23) of the substrate (22) than at the first surface (21).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS RELAYS SELECTORS TRANSPORTING |
| title | Electrical connection through a substrate to a microelectromechanical device |
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