METHOD FOR PACKAGING COMPONENTS

The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WOELFING, BERND, FLEISSNER, FRANK, BRAUNECK, ULF, FOTHERINGHAM, ULRICH, BIERTUEMPFEL, RALF, MUND, DIETRICH, AUCHTER-KRUMMEL, PETRA, PAWLOWSKI, EDGAR, HAYDEN, JOSEPH, S, SEIDEMANN, VOLKER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!