Fluid cooled semiconductor power module having double-sided cooling

A semiconductor power module (10,10') includes one or more semiconductor power devices (70,72) sandwiched between a fluid conducting base (12) and a fluid conducting cover (14a) joined to the base (12). Fluid coolant entering the base (12) diverges into a first flow path through the base (12) a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	GERBSCH, ERICH W
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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