PROCESSING PIEZOELECTRIC MATERIAL

Techniques are described for forming actuators having piezoelectric material. A block of piezoelectric material is bonded to a transfer substrate. The block is then polished. The polished surface is bonded to a MEMS body.

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Bibliographische Detailangaben
Hauptverfasser: CHEN, ZHENFANG, BIRKMEYER, JEFFREY
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Techniques are described for forming actuators having piezoelectric material. A block of piezoelectric material is bonded to a transfer substrate. The block is then polished. The polished surface is bonded to a MEMS body.