Packaging of low application hot melt adhesive formulations
Films having a melting point below about 100°C are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking.
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| creator | PAUL, CHARLES, W RODGERS, ANTHONY, P |
| description | Films having a melting point below about 100°C are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking. |
| format | Patent |
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| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP1990282A2 |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CONVEYING DYES HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS MAKING GRANULES OR PREFORMS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PACKING PAINTS PERFORMING OPERATIONS POLISHES PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS STORING TRANSPORTING UNPACKING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Packaging of low application hot melt adhesive formulations |
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