CONDUCTIVE PASTE, MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE

A conductive paste comprising 88-94% by mass of Ag powder having an average particle size of 3 µm or less and 0.1-3% by mass of Pd powder, the total amount of the Ag powder and the Pd powder being 88.1-95% by mass. A multilayer ceramic substrate obtained by laminating and sintering pluralities of ce...

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Hauptverfasser:	IKEDA, HATSUO, ICHIKAWA, KOJI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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