ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE
An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resi...
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creator | MINAMI, HIDEKI FUJITA, JUN YAMASAKI, TAKASHI KOBORI, NAMI |
description | An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator. |
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The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081008&DB=EPODOC&CC=EP&NR=1976952A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20081008&DB=EPODOC&CC=EP&NR=1976952A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MINAMI, HIDEKI</creatorcontrib><creatorcontrib>FUJITA, JUN</creatorcontrib><creatorcontrib>YAMASAKI, TAKASHI</creatorcontrib><creatorcontrib>KOBORI, NAMI</creatorcontrib><title>ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE</title><description>An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7EOgjAQgGEWB6O-w70AAxo1jJfrAZe014YWVkJMnYyS4PtHBx_A6V--f1somo6jjAyshCEOFpNoC-Rd8FGSeIVGrANUA75vUYWALVPqvR2cKEf6ngyGRyHeF5v7_Fjz4dddAQ0n6sq8vKa8LvMtP_N74lDV10t9PmJ1-oN8AN69Lm0</recordid><startdate>20081008</startdate><enddate>20081008</enddate><creator>MINAMI, HIDEKI</creator><creator>FUJITA, JUN</creator><creator>YAMASAKI, TAKASHI</creator><creator>KOBORI, NAMI</creator><scope>EVB</scope></search><sort><creationdate>20081008</creationdate><title>ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE</title><author>MINAMI, HIDEKI ; FUJITA, JUN ; YAMASAKI, TAKASHI ; KOBORI, NAMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1976952A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2008</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>MINAMI, HIDEKI</creatorcontrib><creatorcontrib>FUJITA, JUN</creatorcontrib><creatorcontrib>YAMASAKI, TAKASHI</creatorcontrib><creatorcontrib>KOBORI, NAMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MINAMI, HIDEKI</au><au>FUJITA, JUN</au><au>YAMASAKI, TAKASHI</au><au>KOBORI, NAMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE</title><date>2008-10-08</date><risdate>2008</risdate><abstract>An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
title | ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE |
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